Multi-Layered Circuits

Multi‐Layered flexible circuits are the least common of the flexible circuit family. They consist of from three – six conductive layers thus “multi‐layered” and the appropriate number of insulating layers, one between each of the conductive layers and two outside layers on top and bottom. These circuits have an overall thickness range of 9.1 (.0091”) to 23.5 (.0235”) mils typically. These circuits are typically not very flexible and are chosen for overall thickness characteristics rather than flexibility. The complexity achievable with multi‐layered circuits includes controlled impedance and EMI shielded designs and are typically found in telecommunications and RF & Microwave designs. All component types can be attached to multi‐layerd circuits and current carrying capabilities of signal traces range from a few milliamps to several amps.

• Standard and robust construction well suited for complex electronic products
• Thin, light weight and durable enough to outlast your product life cycle
• Wide operating temperature range from ‐55°C ‐ 150°C
• Mount all component types – surface mount (SMT), thru – hole, crimp on pins, wire bond, BGA
• Meets IPC‐6013 Qualifications and Performance Specifications for Flexible Printed Boards

• Layer Count: 2 ‐ 6 conductive layers
• Trace/Space: .004”/.004” typical, .003”/.003” non‐typical
• Current Carrying Capacity: few milliamps to several amps
• Hole Size: .006” drilled/plated and .008” drilled/not plated typical, .004” laser drilled/plated non-typical
• Copper Thickness: ¼ oz, ½ oz, 1 oz, 2 oz typical, 7.8 mil & 10 mil non‐typical
• Material thickness: 1 mil, 2 mil typical, 3 mil and 5 mil non‐typical
• FR4 Stiffener Thickness: .010” ‐ .125”
• Polyimide Stiffener thickness: .002” ‐ .010”